Bendable Electronics

[unhappycamper]

Bendable Electronics
Air Force Print News | Molly Lachance | February 01, 2008

ARLINGTON, Va. - Air Force Office of Scientific Research officials here recently have provided research funding for fast, bendable electronics to attach to unevenly shaped objects like airplane bodies or engines.

A research team led by Dr. Zhenqiang Ma of the University of Wisconsin-Madison has developed super-flexible silicon chips that can withstand impact and severe vibration.

By adding pressure to the chips, Dr. Ma and Max Lagally have increased chip performance to speeds 50 times faster than previous efforts.

Dr. Ma is also working on flexible photodetectors, or optoelectronics, which are applicable for high-speed photography.

"When the optoelectronics are arranged in a hemispherical or spherical shape, the half space or the entire space of interest can be put under surveillance without a moving lens," Dr. Ma said.


Rest of article at: http://www.military.com/features/0,15240,161232,00.html